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SSEC 3300 Systems are supported by a process development laboratory, including SSEC processors, Metrology Equipment and Process Staff, exclusively for the use of SSEC customers.
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Clean Processing
Particulate Contamination
Chemical Contamination
Backside and Edge Surface Contamination
- In-Situ Post Etch Clean
- In-Situ Post Strip Clean
- Pre Deposition Clean
- Post CMP Wafer Clean
- Prime Wafer Clean
- Backside and Bevel Clean
- Pre-bond Wafer Clean
- Wafer Reclaim
Strip Processing
FEOL/BEOL
- High Dose Implant Photoresist Strip
- Post Etch Residue Removal
- Post Metal Gate Cleaning
MEMS
- Lift Off
- Photoresist Strip
- Post etch residue removal
Advanced Packaging
- Dry Film Strip
- Photoresist Strip
- Flux Cleaning
Compound Semiconductor
- Lift Off (includes metal and other materials)
- Photoresist Strip
Wet Etch Processing
Uniformity and Selectivity
Multiple Process Levels
No Cross-contamination
FEOL/BEOL
- Photoresist strip with Hot SPM (>170°C)
- Backside & bevel films etch
- Wafer Thinning
MEMS
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Metals Etch on Patterned Wafer (Ag,
Ni, Cr, TiW, Cu, Al)
- Film Etch on Backside (SiO2,Si3,N4, Polysilicon, Zinc Oxide)
- Wafer Thinning
Advanced Packaging
- Wafer Thinning & Texturing
- RDL Etch
- UBM Etch (Cu, Al, Ti, TiW)
Compound Semiconductor
- InGaP Selective Etch
- MESA Etch
- Gate Recess Etch
- lnP Etch
- Stress Relief Etch
Photolithographic Processing
- Single or Double Sided Coating
- Spin Resist Coat/Bake/Chill Processing
- Spin Polyimide Coat/High Temperature Bake/Chill Processing
- Spray Coat/Bake Processing
- Aqueous Developing
- Solvent Developing
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