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October 3, 2008 - Multi-wafer Size, Single Side Wet Etch Spindle Tooling
Highest equipment utilization with multiple size wafers for .... <MORE> |
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May 16, 2008 - SSEC Enhances Productivity for Wafer Thinning
Wafer Thinning and Stress Release production is now enhanced by SSEC... <MORE> |
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April 1, 2008 - SSEC Delivers Another 3310 Wet Processor
Solid State Equipment Corporation announces the delivery of another SSEC 3310... <MORE> |
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March 18, 2008 - SSEC 3305 Processor Increases Throughput for Metal Lift-off
Solid State Equipment Corporation announces volume production of the SSEC... <MORE> |
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March 17, 2008 - SSEC Processors Make Data Accessible in SQL Database
Solid State Equipment Corporation announces that its processors are equipped... <MORE> |
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August 03, 2007 - New SSEC 3404 System Processes up to 100 Flat Displays per Hour
Solid State Equipment Corporation announces the SSEC 3404 wet processor... <MORE> |
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June 25, 2007 - New SSEC Brush Box Enhances Double-sided Wafer Cleaning
Solid State Equipment Corporation announces a new brush box that improves... <MORE> |
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June 25, 2007 - SSEC Enhances Wafer Bevel and Side Edge Etching
Solid State Equipment Corporation announces a new capability for spin etching... <MORE> |
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June 25, 2007 - SSEC 3312 Processors Feature 12 Processing Stations
Solid State Equipment Corporation announces the new SSEC 3312... <MORE> |
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April 13, 2007 - SSEC 3300 with Class 1 Mini-environment
Solid State Equipment Corporation is now offering its SSEC 3300... <MORE> |
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April 10, 2007- SSEC Adds New Wet Processing Specialist
Continuing its growth as a leading supplier of single wafer wet processors... <MORE> |
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April 9, 2007 - SSEC Denies Claim in Akrion Lawsuit
“Since the founding of SSEC in 1965, we have always strived to work... <MORE>
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