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Clean
Pre-diffusion Wafer Clean
"" Post Deposition Clean
"" Post Etch Clean
Post CMP Wafer Clean
Prime Wafer Clean
Backside and Bevel Clean
Pre-bond Wafer Clean
Copper Wafer Reclaim
UV Laser Light Cleaning

Strip
Resist Stripping
Metal Lift-off
Flux Removal
Polymer Removal Cleans with Solvents
Poly Stripping

Etch
Backside and Bevel Etch for Oxide,
Nitride, Poly-silicon, Tantalum Nitride,
Fluorosilicate Glass Films,
Borophosphorosilicate Glass Films
UBM (Under Bump Metal) Etch
Aluminum Etch
Copper Etch
Chrome Etch
Gold Etch
• Polymer Removal with DSP
Wafer Thinning/Stress Relief

Develop
Resist/Aqueous Develop
Poly/Solvent Develop

Coat
Resist Coat/Bake/Chill Processing
Resist Coat/Soft/Hard/Bake/Chill
Processing
Poly Coat/High Temperature
    Bake/Chill Processing
Spray Coat Processing


 
Model 3300 ML Model 3301/2 Model 3303/4 Model 3306/8