The SSEC 3800 meets Generation 7 and the evolving Generation FPD panel size requirements for single panel processing in application-specific configurations for clean, coat/bake/chill/develop, etch, and strip. These systems are built in non-combustible Halar® modules, configurable for low volume manually assisted operation or with up to three modules for volumes to 60 panels per hour.

Each processing module is fully enclosed, with ULPA filtered air or inert gas backfilled into the module. Each processing module is configurable with up to eight dispense arms. Arms may be fitted with high velocity sprays, high pressure sprays, megasonic scrubs, PVA brush assemblies, chemistry application nozzles, and more. Up to four drains are available per chamber to provide chemical separation for recirculation or waste collection. The system includes onboard chemistry management, including recipe-driven, closed-loop chemistry blending and true single wafer, on-the-fly temperature control. For wet etch, in-situ, adaptive process control is provided by SSEC’s exclusive WaferChek™ system, which manages the wet chemistry processing by the optical properties of the wafer surface.

An edge grip flipping station is available for double-sided processing requirements. Vision processing, with closed loop control, supports safe, efficient handling for your valuable panels.

The Windows®-based, object-oriented software provides a convenient user interface, and supports complete management of processing and data logging.

All systems are SEMI® S2-0703aE safety and S8-0705 ergonomic compliant, CE marked, and ETL listed.