SSEC 3400 ML systems handle substrates up to 500 mm x 500 mm. These systems implement automatic processing with manual load of FPDs or glass substrates and are dry-in/dry-out for maximum operator safety with harsh chemistries. They are available in either bulkhead or ballroom styles, with air in the mini-environment processed by ULPA filtration.

Each processing module is configurable for application-specific requirements, including clean, coat/bake/chill/develop clusters, wet etch, and strip, with up to six dispense arms and four chemical drains. Arms may be fitted with high velocity sprays, megasonic scrubs, PVA brush assemblies, chemistry application nozzles, and more. Each chamber is fully enclosed, and is backfilled with ULPA filtered air or inert gas. The system includes onboard chemistry management, with recipe-driven, closed-loop controlled chemistry blending and true single wafer, on-the-fly temperature control. For many applications, in-situ, adaptive process control is provided by SSEC’s exclusive WaferChek™ system, which manages the wet chemistry processing by the optical properties of the wafer surface.

The SSEC 3400 ML family of wet cleaners and processors implements single wafer technology in application-specific configurations for cleaning, coating, developing, etching, and solvent processing of flat panel displays and glass in a completely digital processing environment. SSEC’s Windows® based, object oriented software provides a convenient user interface and supports complete management of processing and data logging. 

All systems are SEMI® S2-0703aE safety and S8-0705 ergonomic compliant, CE marked, and ETL listed.