Processors for Every Product

The power of SSEC's single wafer wet processing and cleaning technology can be scaled for successful application to your exact product and manufacturing requirements, for wafers 50 mm to 300 mm, photomasks, and flat panel displays. SSEC systems can be configured for volumes ranging from 200 wafers per hour down to laboratory requirements.

Single Wafer Wet Processing Applications

SSEC 3300 Systems are supported by a process development laboratory, including SSEC processors, Metrology Equipment and Process Staff, exclusively for the use of SSEC customers.

Click on the links below for more information on specific machine models for Single Wafer Wet Processing

Model 3300 ML

Model 3301/2

Model 3303/4

Model 3305/6

Model 3306/8

SSEC 3300 Applications
TSV Resist & Sidewall Polymer Removal PR & Dry Film Stripping Flux Cleaning UBM & RDL Etch (Cu, Ti, TiW, TiWN, Ni, Al) Backside Cleaning Wafer Thinning & Stress Relief Wafer Thinning to TSV Pre-Bond Wafer Cleaning Wafer Cleaning Coat/Bake/Chill Develop/Bake/Chill Photomask Cleaning	Lift-Off (includes metal and other materials) Photoresist Strip InGaP Selective Etch MESA Etch Gate Recess Etch Pre-Deposition Treatment Etch InP Etch Wafer Thinning and Stress Relief Etch In-Situ Post Etch Clean In-Situ Post Strip Clean Post CMP Wafer Clean Prime Wafer Clean Pre-Bond Wafer Clean Backside and Bevel Clean Coat/Bake/Chill Develop/Bake/Chill Photomask Cleaning
High Dose Implant Photoresist Strip Photoresist Strip with Hot SPM Backside and Bevel Film Removal & Cleaning Post Etch Residue Removal Post Metal Gate Cleaning Wafer Re-Claim Prime Wafer Clean Post CMP Cleaning In-Situ Post Etch Clean In-Situ Post Strip Clean Pre-Bond Wafer Clean Pre-Deposition Clean	Trench Clean Lift-Off Photoresist Strip Post Etch Residue Removal Metals Etch on patterned wafer (Ag, Ni, Cr, TiW, Cu, Al) Film Etch on backside (SiO2, Si3N4, Polysilicon, Zinc Oxide) KOH Anisotropic Wet Etch for AI2O3 and Si Wafer Thinning & Texturing Post CMP Cleaning In-Situ Post Etch Clean In-Situ Post Strip Clean Pre-Bond Wafer Clean Coat/Bake/Chill Develop/Bake/Chill Photomask Cleaning