Advanced Technologies for Wet Processing and Cleaning

Application Specific Single Wafer Processing Stations

For optimized processing performance, low operation costs and superior reliability SSEC offers molded processing chambers configured specifically for the process.

	Clean Processing SSEC’s Clean 3300 Chambers may be sealed or open with make up air from ULPA Filtration and Air Ionizers. Chamber Air Flow is Electronically monitored and may be servo by recipe.
	Solvent Processing Chambers SSEC Sealed Solvent Processing Chambers with Programmable Inert Environment may be configured with multiple, programmable drainage systems. An In-Situ open or closed chemical collection ring may be configured for precise chemical separation or re-circulation enabling post strip In-Situ clean processing.
	Wet Etch Processing Chambers SSEC’s Wet Etch Processing Chambers include programmable chamber air flow, chamber temperature monitoring and an integrated color CCD camera utilized SSEC's WaferChek™ software for adaptive process control for metal and film etching. An In-Situ open or closed chemical collection ring may be configured for precise chemical re-circulation enabling In-Situ post etch cleaning.

	Complete Cleaning Solutions SSEC’s Cleaning Processors are configurable with PC programmable chemical blending for SC-1, SC-2, DHF, etc. All Cleaning processing is performed in a class 1 minienvironment and processing chamber.
	High Velocity Spray Scrub SSEC’s HVS provides recipe control over droplet size and speed on programmable dispense arm for complete surface cleaning of wafers to 300 mm, including post etch and post strip In-Situ cleans.
	Single Wafer Megasonic Scrubbing SSEC’s Tri-sonic Scrubbing Nozzle provides for highest power density in industry with programmable duty cycle. The DSP controller provides feedback on the transducer for closed loop operation.
	Rotary PVA Brush Scrubbing SSEC’s PVA Brush Scrubbing include through-the-brush fluid dispensing, high speed servo motor driven rotation and an embedded tranducer, with DSP controller, for consistent scrubbing force from center to edge of wafer.
	Double-Sided PVA Brush Scrubbing "US Patent 5,675,856, Reissue Re. 36,767" Provides for top, bottom and side surface scrubbing with high speeds and pressure. Capabilities include through-the-brush chemical dispensing, brush auto conditioning and integrated wafer spraying.
	Post CMP Wet Input SSEC’s Post Polish Cleaning configuration includes a Wet Input Station to keep slurries wet and enable highest yield final clean, with particle counts after CMP lower than entering CMP operations.
	High Pressure Scrubbing SSEC’s High Pressure Scrubbing provides for continuous flow of fluids, with no flow rate change for pump re-charging. Recipe driven dispense of high pressure heated dispense of needle and spray nozzle. Recipe driven high pressure flow rate control.
	Single-Sided Gas Seal Wafer Spindle Tooling SSEC’s Gas Sealing tooling enables processing of a wafer surface with no chemical or vapor exposure to backside. The gas seal chuck can be temperature controlled for specific wet etch and strip processes.
	Post Processing In-Situ Cleaning SSEC's In-Situ Chemical Collection System can be configured in etch processing chambers. Chemical collection effieciency is >99% and allows constant replenishment for re-circulated solutions. In-Situ Post Etch Cleaning is enabled with all SSEC clean technology tools.

	Immersion Processing SSEC’s Immersion Solvent Processing includes inert environment, heated solvent processing, submersible spraying and heated re-circulation with mechanical agitation. Equal Soak Time software assures each wafer will soak for the exact same time, as recipe programmed, while having the system operate in continuous mode for highest WPH.
	Immersion Processing with Ultrasonics SSEC Immersion Chambers are available with Ultrasonic Scrubbing with Bonded Transducers and Programmable Power, Power Percentage and Frequency, including Sweep and Dual Sweep from 170Hz to 470Hz.
	High Pressure Scrubbing SSEC’s High Pressure Scrubbing with high pressure flow rate control, continuous dispensing and high pressure temperature control provide the most controlled solvent scrub processing to your wafer surface.
	High Pressure Temperature Control SSEC’s High Pressure Fluid dispensing is rated to 3,000 PSI. The heater utilizes an optimal control technique for rapid response. The system is ETL certified.
	High Pressure Pump SSEC’s High Pressure pumping system is completely designed and fabricated by SSEC for continuous operations over 1 year of cycling.
	Solvent Brush Scrubbing Single-Sided nylon bristle Brush Scrubbing with through-the-brush Solvent Dispensing for clean, repeatable results. Electronic brush bristle sensing ensures repeatable bristle contact from wafer to wafer.
	After Post Process In-Situ Cleaning SSEC’s In-Situ Chemical Collection System can be configured in strip processing chambers. Chemical collection effieciency is >99% and allows constant replenishment for re-circulated solutions. In-Situ Post Strip Cleaning is enabled with all SSEC clean technology tools.

	Uniform Processing SSEC's proprietary dispensing technology, including on-the-fly programmable flow rates and dispensing modulation assures uniform etching over all areas of the wafer. SSEC's WaferChek™ System provides In-Situ adaptive process control, combined with programmable chemical blending, temperature control and more, to enable wafer uniformities both within wafer and wafer to wafer typically <1%.
	In-Situ Chemical Collection System SSEC's In-Situ Chemical Collection System can be configured in etch processing chambers. Chemical collection effieciency is >99% and allows constant replenishment for re-circulated solutions. In-Situ Post Etch Cleaning is enabled with all SSEC clean technology tools.
	In-Situ Adaptive Process Control SSEC's WaferChek™ is a color CCD camera which analyzes the full spectrum of reflected surface and processes the entire waveform for most accurate endpoint. SSEC’s WaferChek™ enables correction of etch and over-etch times while reducing cycle time and prevents over-processing.
	Cu Over Ti-W
	Si Wafer Thinning SSEC’s wafer thinning utilizes pre-mixed or PC programmable etch solutions for backside wafer thinning to thin, remove mechanical stresses and control surface roughness. Excellent Removal Uniformity and Control of Surface Roughness (Ra) while maintaining TTV. SSEC’s wafer thinning to TSV enables etch to the copper or tungsten filled TSV without metal damage.
	SSEC Bevel Etch Processing SSEC's Bevel Etch Processing with a separate Bevel Etch Fluid Control Channel with Programmable Flow Rate enabling Bevel Area Etch from 0.8 mm to 5 mm, including Flats processing.
	SSEC Backside & Bevel Strip Selectivity for Etching of 7 Layers with Alternating Films
	Selectivity By recipe selection from SECS GEM Link, PC Programmable Chemical Blending from concentrated mixtures to dilution rates in excess of 1:10,000. Temperature Control may be provided to the boiling point of the fluid with ± 0.1C as required.
	Post Processing In-Situ Cleaning SSEC’s Programmable Open or Closed Chemical Collection System provides >99% Efficiencies in Chemistry Collection. In-Situ, post etch and post strip clean processing is available with all SSEC cleaning tools.

	Robotic Driven Coat/Bake/Chill Processing SSEC’s robotic driven spindle coat processors provide non-contact wafer alignment and enable rapid size changes utilizing SSEC’s vision processing system.
	Positive Displacement Resist Metering Pumps SSEC’s resist metering pumps are sized by application from application from 1-12 ml/ stroke to 100 ml/stroke. The motorized pumps handle a wide range of viscosities, < 1 cP to 12,000 cP, with per step motor control over speed, acceleration and deceleration for precise dispense volume, suckback speed and suckback volume control by recipe. Systems including Resist & Air Bubble Sensors with Return Loop to Bottle.
	Spin Coating SSEC’s 3300 Spin Motor Controller utilizes a flash loaded, DSP Controller for real time, closed loop spindle motor control. All aspects of the motor are controlled most rapidly and with complete feedback including acceleration, rate and decleration parameters.
	Bake/Chill Processing SSEC’s Hot Plate Bake systems are programmable for Proximity or Contact Bake. Heated make up Gas with differing Hot Plate Temperature and Uniformity Configurations from soft bake to post exposure bakes. Programmable passive and active chill stations with HMDS Vapor Prime available.
	Backside EBR for Square Panels SSEC’s square panel EBR system enables post coat cleaning of square panels sides and topside EBR processing.
	Developer Processing SSEC’s Aqueous and Solvent Develop Processing with Low Impact Stream and Spray Processing, available TMAH Chemistry Blending, Solvent Processing and re-circulation, with configurations available to 12 stations.

	SSEC Single Wafer Solutions SSEC’s complete, SEMI^® Safety & Ergonomic Compliant, Fully Automatic, Dry-in/Dry-out Single Wafer Wet Processing Solutions. Standard off-the-shelf components configured to your processing and manufacturing requirements.
	Application-Specific Chemistry Temperature Control SSEC’s Temperature Control to the boiling point or flash point of the solution with final temperature control to requirement, including ± 0.1°C. Systems include Quartz Heaters, Polymer Heaters and Fluid Heat Exchangers configured for on-the-fly temperature control.
	Chemical Blending SSEC’s Chemical Blending systems are recipe driven and configured for cleaning (SC-1, SC-2, DI:HF) and etch (HF:HNO3, H2SO4:H2O2:H2O), with in between plumbing rinse to resistance, enables use with fab general chemistry with process selectivity.
	In-Situ Chemical Collection System SSEC's In-Situ Chemical Collection System can be configured in etch processing chambers. Chemical collection effieciency is >99% and allows constant replenishment for re-circulated solutions. In-Situ Post Etch or Post Strip Cleaning is enabled with all SSEC clean technology tools.
	SSEC Process Development Laboratory SSEC’s support to customers includes complete process development. A permanent staffs and complete wet processing with all SSEC 3300 capabilities plus industry standard metrology equipment enables comprehensive support.
	Ultra Clean, Small Foot Print Systems SSEC Systems are designed and proven with class 1 minienvironments, including an automation system which enables vertical stacking of process modules.
	SSEC 3300 System Design SSEC components and systems are 3D CAD designed and configured to insure easy and rapid maintenance access to maintain the highest system availability. All Systems are SEMI® S2-0706E Safety, SEMI® S8-0705 Ergonomic, SEMI® S23 Green and SEMI® S47 Power Compliant; ETL Listed and CE Marked.
	SSEC 3300 Robotics SSEC’s Application Specific, Class 1 Robotic Handlers design for vacuum or edge grip handling for dry or wet wafers.
	SSEC SQL Data Front End SSEC enables real time or historical data analysis from your network. Standard off-the-shelf SQL Database tools may be used. Access can be local or remote for multiple 3300 systems on the network.
	Bulk Chemistry Management Systems SSEC provides solutions which are completed with SEMI® Safety & Ergonimic compliant bulk chemical delivery systems. Systems may be configured for 1, 5 or 55 gallon drums with on board, Programmable Level Sensing and Conditions. "No Touch Chemistry" handling.
	3450 Series for 450 mm Wafers SSEC’s 3450 series is specifically configured for 450 mm Wafers, including molded chambers, processing chambers and all scaled up features of the 3300 proccessors. For Initial Development, a cost effective 3 station system, with Class 1 Minievironment and 450 mm FOUP loader. As production requirements increase, SSEC will offer increased chamber sizes and FOUP loaders.

Clean
Backside Cleaning Backside & Bevel Cleaning Wafer Cleaning In-Situ Post Etch Cleaning In-Situ Post Strip Cleaning Pre-Bond Wafer Cleaning	Post CMP Wafer Cleaning Wafer Reclaim Prime Wafer Cleaning Post Metal Gate Cleaning Pre-Deposition Cleaning
Etch
UBM & RDL Etch (Cu, Ti, TiW, TiWN, Ni, Al) Metals Etch on Patterned Wafer (Ag, Ni, Cr, TiW, Cu, Al) Wafer Thinning & Stress Relief Wafer Thinning & Texturing Wafer Thinning to TSV KOH Anisotropic Wet Etch for AI2O3 and Si Film Etch on Backside (SiO2,Si3,N4, Polysilicon, Zinc Oxide)	Bevel Film Etch (SiO2,Si3,N4, Polysilicon, Zinc Oxide) InGaP Selective Etch MESA Etch Gate Recess Etch InP Etch Pre-Deposition Treatment Etch
Strip
TSV Resist & Sidewall Polymer Removal Post Etch Residue Removal PR & Dry Film Stripping Flux Cleaning Lift Off (Metals & Other Materials)	Trench Clean Photoresist Strip Photoresist Strip with Hot SPM High Dose Implant Photoresist Strip
Photolithography
Coat/Bake/Chill Processing Bake/Chill/Develop Processing	Photomask Cleaning