WaferEtch & WaferStorm

The WaferEtch Platform: An Innovative Solution for Wafer Processing, including TSV Reveal
The flagship of the WaferEtch platform, the TSV REVEALER, is specifically configured to address the requirements of TSV reveal, which is the process where the backside of the wafer is thinned to reveal the copper interconnects. It has become a target area in the manufacture of 2.5D and 3D-IC packaging for process control and cost reduction. The TSV REVEALER replaces four tools required for the dry-etch approach: CMP, plasma etch, silicon thickness measurement, and wafer cleaning. Integration of a thickness measurement sensor in the etch system provides closed-loop control of the wafer etching process. The TSV REVEALER achieves a significant reduction in CoO, making 3D TSVs more economically feasible. Download brochure

The WaferStorm Platform: Unique Soak and Spray Wafer Processing
The WaferStorm platform is a solvent-based platform, initially available in three unique configurations: TSV CLEANER, METAL LIFTER, and THICK FILM REMOVER. All WaferStorm systems are based on SSEC’s unique soak and spray technology, which provides improved performance at lower CoO than conventional wet bench-only or spray-only approaches. The process combines equal soak time in the wet buffer tank for each wafer, followed by spray, and then a final step depending on the process being performed. This unique combination minimizes both spray time and chemistry use, and adds a significant level of control during wafer processing. The reduction in spray time results in increased throughput. Download brochure

WaferEtch: TSV REVEALER

WaferEtch: TSV REVEALER

TSV reveal, the process in which the backside of the wafer is thinned to reveal the copper interconnects, has become a target area in the manufacturing of 3D ICs for process control and improved cost of ownership (CoO). SSEC’s WaferEtch TSV Revealer is a single-wafer processing tool configured for TSV reveal that replaces four tools required for dry etch process including: CMP, plasma etch, clean, or silicon thickness measurement.

WaferStorm: METAL LIFTER

WaferStorm: METAL LIFTER

Both Compound Semiconductor and Microelectromechancial systems (MEMS) devices employ a material lift-off step in the creation of fine device features. Often termed “metal lift-off”, SSEC’s WaferStorm Lift-off tool is configured for lift-off of non-metallic materials in addition to metals.

WaferStorm: TSV CLEANER

WaferStorm: TSV CLEANER

TSV clean is often overlooked as a critical process step. In reality, it’s essential to reliability. The deep reactive ion etch (DRIE) process used to fabricate TSVs leaves behind a polymer residue that needs to be removed to allow for the defect-free barrier, seed, and fill steps that follow. The process requires both optimized chemistry and the proper tool. SSEC’s WaferStorm TSV CLEANER is configured specifically to perform the process needed for optimal TSV cleaning at a lower cost-of-ownership than conventional wet bench or single spray approaches.

WaferStorm: THICK FILM REMOVER

WaferStorm: THICK FILM REMOVER

Thick film photoresist and lamination have become useful processes in TSV etch and bump plating processed for wafer level and 2.5D and 3DIC fabrication processes. Removal of these films is both necessary and challenging. SSEC’s WaferStorm thick film remover combines specially formulated chemistries with its proprietary Soak and Spray configuration for a robust solution to stripping thick film resist.

WaferStorm: FLUX CLEANER

WaferStorm: FLUX CLEANER

In advanced packaging, fluxing is critical to both wafer bumping and joint formation processes because it removes oxide layers and other impurities left by solder materials to ensure a clean metallic interface for the next assembly step. A liquid fluxing agent is delivered to the bumped surface, and additional cleaning steps must be used to remove residues that are left behind. As bump pitches become finer, removing flux residues has become more challenging. SSEC’s proprietary soak-and-spray technology on the WaferStorm platform is especially suited for removal of flux residues from even the tightest spaces.

WaferEtch: TSV REVEALER

The TSV REVEALER, is specifically configured to address the requirements of TSV reveal, which is the process where the backside of the wafer is thinned to reveal the copper interconnects. It has become a target area in the manufacture of 2.5D and 3D IC packaging for process control and cost reduction. The TSV REVEALER replaces three tools required for the dry etch approach: plasma etch, silicon thickness measurement, and clean. An optical end point detection system with advanced algorithms determines when vias are revealed. Integration of a wafer thickness measurement sensor in the etch system provides closed-loop control of the etching process. The TSV REVEALER achieves a significant reduction in CoO making 3D TSVs more economically feasible. Download brochure  

Features:

  • Available in manual or automatic load
  • Etch Chamber
  • In Situ Cleaning
  • Etch Depth Profiling
  • Arm Movement compensates for radial wafer deformities
  • Optical End Point Detection

Applications:

  • 2.5D Interposers
  • 3D ICs

WaferStorm: METAL LIFTER

This solvent-based system integrates SSEC’s proprietary soak and spray combination for improved yield, higher throughput, and lower chemical cost than conventional wet bench or single spray tools. The immersion station operates in a low-oxygen atmosphere, which maintains the bath longer. Following a soak in the immersion tank, lift-off takes place in a spray station using a high-pressure chemical spray, which translates to increased throughput. Download brochure  

Features:

  • Heated immersion tank
  • Spray station
  • Lift-off material filtration station
  • Strainers for separating gold particles
  • High pressure flow rate and monitoring
  • Programmable High and low interlocks

Applications:

  • MEMS
  • Compound Semiconductors

WaferStorm: TSV CLEANER

TSV clean is a critical process step that is essential to reliability. The deep reactive ion etch (DRIE) process leaves behind a polymer residue which can lead to defects and voids in the barrier, seed, and fill steps that follow. The WaferStorm TSV CLEANER is proven to remove residues in high-aspect-ratio holes that wet bench-only or spray-only tools leave behind. The tool features equal-time soak software for process control. Download brochure  

Features:

  • Multiple wafer buffer tank
  • Individual wafer timer
  • Continuous wafer load
  • Drip tray
  • Spray Chamber

Applications:

  • 2.5D Interposers
  • 3D ICs

WaferStorm: THICK FILM REMOVER

The WaferStorm THICK FILM REMOVER combines heated chemistries and proprietary soak and spray at high pressure for rapid and complete removal of stubborn thick film residue. The soak step uses heated solvents throughout the buffer cycle time. After being softened by the soak, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of thick film residue. This combination ensures thorough removal and increased throughput. Download brochure  

Features:

  • Heated, recirculating solvent immersion tank
  • Spin process station with heating capabilities
  • High pressure sprayer up to 3000psi
  • Needle and Fan Spray modes
  • Flow rate monitoring system
  • Per wafer data collection software

Applications:

  • Wafer Level Packaging
  • 2.5D Interposer
  • 3D ICs

WaferStorm: FLUX CLEANER

In advanced packaging, fluxing is critical to both wafer bumping and joint formation processes because it removes oxide layers and other impurities left by solder materials to ensure a clean metallic interface for the next assembly step. A liquid fluxing agent is delivered to the bumped surface, and additional cleaning steps must be used to remove residues that are left behind. As bump pitches become finer, removing flux residues has become more challenging. SSEC’s proprietary soak-and-spray technology on the WaferStorm platform is especially suited for removal of flux residues from even the tightest spaces.    

Features:

  • Complete flux removal

Applications:

  • Wafer Level Packaging
  • 2.5D Interposer
  • 3D ICs

Inquiry: