Clean 3300 Chambers may be sealed or open, directly under ULPA Filteration and Air-Reonizers. The air flow of the chamber may be programmed by each process step of the recipe. Multiple dispeners may be configured for a variety of contact and non-contact scrubbers, single or double sided.
Inert Atmospheric Chambers for Heated Solvent Processing
Solvent 3300 Chambers are sealed and backfilled with a nitrogen environment. The N2 Environment reduces solvent exposure to moisture prolonging solvent life and lowering costs.
Wet Etch Processing Chambers
Wet Etch 3300 Chambers are typically sealed and utilize SSEC’s internal chemical collection ring (patent pending) for etchant collection and re-circulation. An integrated color CCD camera provides Adaptive Process Control with SSEC’s exclusive WaferChek software. The temperature of the chamber may be monitored and controlled as programmed by recipe.
Inert Chambers for Low Oxygen Processing for Aqueous Solutions
LOP 3300 Chambers are sealed and backfilled with an Nitrogen environment. The chamber mold has reduced volume so that the inert purge is rapid. An 0.15% Oxygen Envronment is maintained with Adaptive Process Control, to enable <50 ppb of Oxygen in Dl Water.
