Systems Configured to Your Product and Application

SSEC 3306/8

SSEC 3306/8 systems are fully automated with configuration for six to eight processing modules and three robots, each with multiple blade robotic handling for wet or dry wafers for higher volume production. The 3306/8 is available with tooling up to 300 mm wafers and is available in bulkhead or ballroom configuration with class 1 minienvironment.