The SSEC 3300 family of wet cleaners and processors implements single wafer technology in application-specific configurations for cleaning, coating, developing, etching, and solvent processing in a completely digital processing environment.

The Windows®- based, object-oriented software provides a convenient user interface, and supports complete management of processing and data logging.  Available onboard bulk chemical management and blending increase economy, allowing operation with chemistry diluted from bulk concentrate supplies.



Manual Load or Fully Automated Systems

Both manually loaded and fully automated systems are available.  Automated systems may be configured with up to 12 processing modules.

Depending on the process, configuration, and number of modules, production may be from low volume to 200 wafers per hour.  All systems are SEMI S2-0706E safety and SEMI S8-0705E ergonomic compliant, CE marked, and ETL listed.

SSEC 3300 series automated systems are dry-in/-out for maximum operator safety with harsh chemistries.  They are available in either bulkhead or ballroom styles, with air in the mini-environment processed by ULPA filtration.

Wafers may be handled in cassettes per SEMI® ergonomic standards with horizontal cassette loaders, or SMIFs, or with standard 300 mm FOUP openers.  Tooling supports wafers to 300 mm.  Available tooling handles multiple wafer sizes, requiring only a software change when changing wafers.



Comprehensive Selection of Processing Tools

The molded Halar single wafer processing modules are each configurable with up to eight dispense arms and four chemical drains.  The dispense arms may be fitted with high velocity sprays, megasonic scrubs, PVA brush assemblies, chemistry application nozzles, and more.

The system includes onboard chemistry management, with recipe-driven, closed-loop controlled chemistry blending and true single wafer, on-the-fly temperature control.  For many applications, in-situ, adaptive process control is provided by SSEC’s exclusive WaferChek™ system, which manages the wet chemistry processing by the optical properties of the wafer surface.



Automation to Meet Your Production Requirements

Processes may be serial, with wet wafer transfer, or in parallel, depending on the user’s requirements.  The robotic handling system provides up to four blades per handler.  These blades can be used for carrying wet wafers between processing steps, or a blade can be dedicated to movement of finished, dry wafers.

Edge grip handling with feedback sensors, vacuum paddles, wafer flipping/reversing, and vision processing all support the cleanest, most reliable individual handling of your valuable wafers.



SSEC 3300 Models

SSEC 3300 - Manually Loaded, with One Processing Module

SSEC 3301/2 - Fully Automated, with One or Two Processing Modules

SSEC 3303/4 - Fully Automated, with Three or Four Processing Modules

SSEC 3305/6 - Fully Automated, with Five or Six Processing Modules

SSEC 3308/12 - Fully Automated, with Eight through Twelve Processing Modules