• Industry Expert Joins SSEC as Director of Process Technology

October 06, 2008 - To continue to meet and anticipate the processing needs of our customers...

• Multi-wafer Size, Single Side Wet Etch Spindle Tooling

October 03, 2008 - Highest equipment utilization with multiple size wafers for processes...

• SSEC Enhances Productivity for Wafer Thinning

May 16, 2008 - Wafer Thinning and Stress Release production is now enhanced by SSEC’s exclusive gas seal spindle tooling, which enables...

• SSEC Delivers Another 3310 Wet Processor

April 01, 2008 - Solid State Equipment Corporation announces the delivery of another SSEC 3310...