Unveils New Name:
Veeco Precision Surface Processing
With SSEC soak and spray wet process tools, less is more: less chemistry, lower cost, higher throughput, and greater stability. SSEC provides a total solution for metal lift-off for MEMS and compound semiconductor manufacturing.
SSEC’s WaferEtch TSV REVEALER, specifically configured for TSV Reveal, offers improved process control at a lower cost than traditional dry-etch processes. In the world of semiconductor equipment, we call it the Wet Etch Advantage.